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# IEEE DTDA 2025

## Welcome Message

On behalf of organization committee, I warmly welcome you to the inaugural Device Technology for Diversified Applications (DTDA) conference. This three-day conference will be held at TKP Garden City, Sendai, Japan. from October 20th to 22nd, 2025, fully sponsored by the IEEE Electron Devices Society (EDS). DTDA focuses on application-driven cutting-edge technologies. To address diversified applications, DTDA technical sessions are organized by application areas, covering wide range of topics, including MEMS and semiconductor devices. All technologies are discussed for specific applications, which makes technology visible and emphasized for the applications. DTDA’s mission is to provide an informative and entertaining experience for all attendees. To achieve this, the conference includes exciting, invited speakers and presentations from numerous organizations. This year six application areas are scheduled, including Bio/Medical, Robot, Automotive, Energy/Water, and Agriculture/Space. Short courses (FET 100), WiED/YP event, and WTS (World Technology Summit) are scheduled in the afternoon of Monday, October 20th. We have also set aside time for demo sessions, workshops and other networking events to foster connections and engagement.

One luncheon session, chaired by New York Creates, world largest technology development facility located in Albony, New York, USA, will be held on October 22nd. New York Creates will present and discuss “A Global Semiconductor R&D Ecosystem For All” DTDA is where technology meets application. Don’t miss the opportunity to join us for an unforgettable experience.

Finally, as General Chair of DTDA 2025, I wish to express my special appreciation to EDS for their leadership and support, as well as the DTDA Conference Committee for outstanding job they have done in planning and organizing the event.

It is with great pleasure that I extend a worm welcome to everyone attending the 2025 Device Technology for Diversified Applications (DTDA) Conference.

Shu Ikeda
General chair 2025 DTDA
IEEE/EDS, VP of Meetings and Conferences
IEEE Life Fellow
tei Solutions Inc.

## Organization

### Steering Committee

Chair
  Shuji Ikeda (EDS VP of Conferences)
Member
  Bin Zhao (EDS President)
  Ravi M. Todi (EDS Jr. Past President)
  Arokia Nathan (EDS President-Elect)
  John Dallesasse (EDS VP of Strategic Directions)
  Hauqiang Wu (EDS VP of Technical Activities - Mainstream)
  Chen Yang (EDS VP of Technical Activities - Interdisciplinary)
  Merlyne de Souza (EDS VP of Technical Activities - New Initiatives)
  Roger Booth (EDS Treasurer)

### Executive Committee

General Chair
  Shuji Ikeda (tei solutions / Rapidus)
General Co-Chair
  Hiroyuki Akinaga (Hokkaido Univ.)
Program Chair
  Takahiro Shinada (Tohoku Univ.)
Program Co-chair
  Hirofumi Nakagawa (TANAKA PRECIOUS METAL TECHNOLOGIES)
Publication Chair
  Mikiko Tanifuji (National Institute of Informatics)
Publication Co-chair
  Akiyo Nomura (IBM Research - Tokyo)
Sponsorship Chair
  Tomoya Sanuki (KIOXIA)
Publicity Chair
  Yoshihito Yoshimizu (KIOXIA)
Publicity Co-chair
  Mariko Ozawa (TEL)
Publicity Co-chair
  An Chen (IBM)
Financial Chair
  Masahiro Nomura (Univ. of Tokyo)
Financial Co-chair
  Dongyan Xu (The Chinese Univ. of Hong Kong)
Event Chair
  Tetsuya Asai (Hokkaido Univ.)
Event Co-chair
  Akiko Ueda (AIST)
Event Co-chair
  Kenichi Inoue (TANAKA PRECIOUS METAL TECHNOLOGIES)
Forum Session Chair
  Akiko Ueda (AIST)
Demo Session Chair
  Shigeki Hattori (Mitsubishi Chemical)
Art Showcase Chair
  Shimpei Ono (Tohoku Univ.)
Art Showcase Co-chair
  Takashi Nakajima (Tokyo Univ. of Science)
Industrial Advisory Chair
  Takumi Mikawa (SCREEN)
International Advisory Chair
  Shuji Tanaka (Tohoku Univ.)
International Advisory Chair
  Noboru Noguchi (Hokkaido Univ.)

### Application Program Committee

Program Chair
  Takahiro Shinada (Tohoku Univ.)
Program Co-chair
  Hirofumi Nakagawa (TANAKA PRECIOUS METAL TECHNOLOGIES)

#### Application Area 1: Unleashing Power of MEMS

Chair
  Kentaro Totsu (Tohoku Univ.)
Co-chair
  Yongfang Li (Toshiba)
Member
  Shingo Akao (Ball Wave)
  Ryosuke Kaneko (Yokogawa Electric)
  Hsiao-Wen Zan (National Yang Ming Chiao Tung University)

#### Application Area 2: Biosensors, Bioelectronics, Biomedical Devices

Chair
  Madoka Takai (Univ. of Tokyo)
Co-chair
  Yuhei Hayamizu (Inst. of Science Tokyo)
Member
  Ayumi Hirano (Tohoku Univ.)
  Sevn Ingebrandt (Aachen Univ.)
  Takeo Miyake (Waseda Univ.)
  Kazuaki Sawada (Toyohashi University of Technology)
  Agnès TIXIER-MITA (Univ. of Tokyo)

#### Application Area 3: Robotics for Smart Society

Chair
  Masanori Muroyama (Tohoku Inst. of Tech.)
Co-chair
  Chinthaka Premachandra (Shibaura Inst. of Tech.)
Member
  Viraj Muthugala (Singapore Univ. of Technology and Design)
  Asanka Perera (Univ. of Southern Queensland)

#### Application Area 4: Automobile

Chair
  Bernard Lim (Appscard)
Co-chair
  Eu Poh Leng (NXP)
Member
  Chetan Arvind Patil (Indie/NXP)
  Emily Leong Hung Yang (onsemi)
  Sushitha Menon (UKM)

#### Application Area 5: Environmental Impact Mitigation, Energy Reduction and Water Risk Management

Chair
  Shin Nakagawa (SCREEN)
Co-chair
  Slava Libman (FTD Solutions)
Member
  Azusa N. Hattori (I-PEX Piezo Solutions)
  Laurent Pain (CEA-Leti)
  Hiroshi Yano (Univ. of Tsukuba)

#### Application Area 6: Smart Agriculture on the Ground and in Space

Chair
  Mayumi B. Takeyama (Kitami Inst. of Tech.)
Co-chair
  Kazuo Oki (The Univ. Tokyo / KUAS)
Member
  Satoshi Yamamoto (Akita Prefectural Univ.)