IEEE DTDA 2025

Welcome Message

On behalf of organization committee, I warmly welcome you to the inaugural Device Technology for Diversified Applications (DTDA) conference. This three-day conference will be held at TKP Garden City, Sendai, Japan. from October 20th to 22nd, 2025, fully sponsored by the IEEE Electron Devices Society (EDS). DTDA focuses on application-driven cutting-edge technologies. To address diversified applications, DTDA technical sessions are organized by application areas, covering wide range of topics, including MEMS and semiconductor devices. All technologies are discussed for specific applications, which makes technology visible and emphasized for the applications. DTDA’s mission is to provide an informative and entertaining experience for all attendees. To achieve this, the conference includes exciting, invited speakers and presentations from numerous organizations. This year six application areas are scheduled, including Bio/Medical, Robot, Automotive, Energy/Water, and Agriculture/Space. Short courses (FET 100), WiED/YP event, and WTS (World Technology Summit) are scheduled in the afternoon of Monday, October 20th. We have also set aside time for demo sessions, workshops and other networking events to foster connections and engagement.

One luncheon session, chaired by New York Creates, world largest technology development facility located in Albony, New York, USA, will be held on October 22nd. New York Creates will present and discuss “A Global Semiconductor R&D Ecosystem For All” DTDA is where technology meets application. Don’t miss the opportunity to join us for an unforgettable experience.

Finally, as General Chair of DTDA 2025, I wish to express my special appreciation to EDS for their leadership and support, as well as the DTDA Conference Committee for outstanding job they have done in planning and organizing the event.

It is with great pleasure that I extend a worm welcome to everyone attending the 2025 Device Technology for Diversified Applications (DTDA) Conference.

Shu Ikeda

General chair 2025 DTDA
IEEE/EDS, VP of Meetings and Conferences
IEEE Life Fellow
tei Solutions Inc.

Organization

Steering Committee

Chair: Shuji Ikeda (EDS VP of Conferences)
Member: Bin Zhao (EDS President); Ravi M. Todi (EDS Jr. Past President); Arokia Nathan (EDS President-Elect); John Dallesasse (EDS VP of Strategic Directions); Hauqiang Wu (EDS VP of Technical Activities - Mainstream); Chen Yang (EDS VP of Technical Activities - Interdisciplinary); Merlyne de Souza (EDS VP of Technical Activities - New Initiatives); Roger Booth (EDS Treasurer)

Executive Committee


General Chair: Shuji Ikeda (tei solutions / Rapidus)
General Co-Chair: Hiroyuki Akinaga (Hokkaido Univ.)
Program Chair: Takahiro Shinada (Tohoku Univ.)
Program Co-chair: Hirofumi Nakagawa (TANAKA PRECIOUS METAL TECHNOLOGIES)
Publication Chair: Mikiko Tanifuji (National Institute of Informatics)
Publication Co-chair: Akiyo Nomura (IBM Research - Tokyo)
Sponsorship Chair: Tomoya Sanuki (KIOXIA)
Publicity Chair: Yoshihito Yoshimizu (KIOXIA)
Publicity Co-chair: Mariko Ozawa (TEL)
Publicity Co-chair: An Chen (IBM)
Financial Chair: Masahiro Nomura (Univ. of Tokyo)
Financial Co-chair: Dongyan Xu (The Chinese Univ. of Hong Kong)
Event Chair: Tetsuya Asai (Hokkaido Univ.)
Event Co-chair: Akiko Ueda (AIST)
Event Co-chair: Kenichi Inoue (TANAKA PRECIOUS METAL TECHNOLOGIES)
Forum Session Chair: Akiko Ueda (AIST)
Demo Session Chair: Shigeki Hattori (Mitsubishi Chemical)
Art Showcase Chair: Shimpei Ono (Tohoku Univ.)
Art Showcase Co-chair: Takashi Nakajima (Tokyo Univ. of Science)
Industrial Advisory Chair: Takumi Mikawa (SCREEN)
International Advisory Chair: Shuji Tanaka (Tohoku Univ.)
International Advisory Chair: Noboru Noguchi (Hokkaido Univ.)

Application Program Committee

Program Chair: Takahiro Shinada (Tohoku Univ.)
Program Co-chair: Hirofumi Nakagawa (TANAKA PRECIOUS METAL TECHNOLOGIES)
Chair: Kentaro Totsu (Tohoku Univ.)
Co-chair: Yongfang Li (Toshiba)
Member: Shingo Akao (Ball Wave); Ryosuke Kaneko (Yokogawa Electric); Hsiao-Wen Zan (National Yang Ming Chiao Tung University)
Chair: Madoka Takai (Univ. of Tokyo)
Co-chair: Yuhei Hayamizu (Inst. of Science Tokyo)
Member: Ayumi Hirano (Tohoku Univ.); Sevn Ingebrandt (Aachen Univ.); Takeo Miyake (Waseda Univ.); Kazuaki Sawada (Toyohashi University of Technology); Agnès TIXIER-MITA (Univ. of Tokyo)

Application Area 3: Robotics for Smart Society

Chair: Masanori Muroyama (Tohoku Inst. of Tech.)
Co-chair: Chinthaka Premachandra (Shibaura Inst. of Tech.)
Member: Viraj Muthugala (Singapore Univ. of Technology and Design); Asanka Perera (Univ. of Southern Queensland)

Application Area 4: Automobile

Chair: Bernard Lim (Appscard)
Co-chair: Eu Poh Leng (NXP)
Member: Chetan Arvind Patil (Indie/NXP); Emily Leong Hung Yang (onsemi); Sushitha Menon (UKM)

Application Area 5: Environmental Impact Mitigation, Energy Reduction and Water Risk Management

Chair: Shin Nakagawa (SCREEN)
Co-chair: Slava Libman (FTD Solutions)
Member: Azusa N. Hattori (I-PEX Piezo Solutions); Laurent Pain (CEA-Leti); Hiroshi Yano (Univ. of Tsukuba)

Application Area 6: Smart Agriculture on the Ground and in Space

Chair: Mayumi B. Takeyama (Kitami Inst. of Tech.)
Co-chair: Kazuo Oki (The Univ. Tokyo / KUAS)
Member: Satoshi Yamamoto (Akita Prefectural Univ.)