Invited Speakers
Application Area 1
Contribution to solving social problems through MOEMS technology that enables equipment miniaturization
Manager, Hamamatsu Photonics K.K
Abstract
MOEMS (Micro Opto Electro Mechanical Systems) technology, which adds optical functions to MEMS, is effective for miniaturization and mass production of spectrometers and scanning mirrors. Devices that were previously used in laboratories and hospital diagnostic rooms have been miniaturized and made into portable devices, etc. They are now being used in places close to our daily lives. On the other hand, many developed countries are facing the challenges of declining working-age populations, global warming, and plastic waste. In this talk, I will present how MOEMS technology can contribute to these social issues with specific examples.
Application Area 2
Soft Materials for Bioresorbable Medical Devices
Abstract
Modern integrated circuit technology has an impressive ability to maintain stable operation with exceptional reliability, often without undergoing any physical or chemical changes. However, a new class of electronic materials offers the opposite outcome – transient devices that can dissolve, disintegrate, or disappear at specified times or rates. Water-soluble transient electronics present intriguing possibilities for bioresorbable medical implants, which can be tailored to dissolve based on an individual’s body chemistry. In my presentation, I will introduce fundamental concepts in chemistry, materials science, and assembly processes related to the development of bioresorbable medical devices. As an illustrative example, I will discuss wireless electronic stimulators designed to treat temporary bradycardia.
Towards brain-wide neural electrical recording
Associate Professor, Department of Biomedical Engineering, College of Future technology, Peking University
Abstract
Brain-wide neural activity recording with high spatiotemporal resolution is important for unraveling the intricate orchestration of neural processes that underpin cognitive functions. Here we present our progress in developing high channel-count, high-density neural probes with lengths in the range of 10-90 mm, covering the brain size of rodents and primates. With the thousand simultaneously recorded channels, unprecedented probe length, excellent mechanical stability, and flexible recording site distribution, these probes enable a brain-wide neuronal recording in both rodents and non-human primates. In terms of large-area electrocorticography (ECoG) recording, we developed a shape-changing electrode array which can be implanted in a minimally-invasive manner into the brain of both rodents and canines. The brain-wide neural recording with high spatiotemporal resolution by these neural probes and electrode array enable a wide range of new experimental paradigms for fundamental and translational neuroscience studies.
Material and Scaling Aspects for Biosensors and Cell-Device Interfacing with Micro- and Nanoelectronic Devices
Abstract
Application Area 3
From Human Mimicry to Robotic Mastery: How Sensor-Driven Telerobotics Paves the Way for AI Imitation of Complex Tasks
Technical Engineer at TsukArm Robotics, TsukArm Robotics / Shibaura Institute of Technology
Abstract
Bridging the gap between human dexterity and robotic capability is a key challenge for a smart society. In this talk we will introduces a framework that transitions from human mimicry to robotic mastery. Our approach leverages an intuitive sensor-driven telerobotics system, founded on MEMS-based wearable inertial sensors, to capture the nuances of human motion. This high-fidelity demonstration data then trains an AI imitation model, enabling the robot to autonomously replicate and adapt to complex tasks. By directly translating human skill into machine intelligence, this methodology dramatically accelerates robot programming, unlocking new applications in dexterous manufacturing and human-robot collaboration.
Application Area 4
Transformation Through Innovation in Automotive Semiconductor Packaging
NXP Semiconductor
Abstract
In a rapidly evolving world, innovation plays a crucial role in shaping the technologies of tomorrow. The automotive industry, in particular, is undergoing a transformation through advancements in electronic packaging to enable safer, more reliable, and secure mobility solutions. These innovations are helping to integrate semiconductors into vehicles more efficiently, enhancing performance, and supporting the development of electric and autonomous vehicles.
The future of semiconductor packaging looks promising, with breakthroughs driving improvements in sustainability, efficiency, and safety. The exciting part is that the future is not a distant dream—it is happening now!
This sharing aims to inspire you to embrace innovation, explore new ideas, and play an active role in transforming the world. Together, we can harness the power of technology to create a better, safer, and more sustainable future for generations to come.
Application Area 5
The trend of circularly mitigating energy consumption and wastes for a semiconductor chips manufacturing fab.
Professor Emeritus, National Taiwan University & Purdue University
Abstract
The innovative use of semiconductor chips continuously enhances applied technology, scientific knowledge and human life. To facilitate its manufacturing, fabrication plant (fab) is a part of and prerequisite to the manufacturing. In the fab, the latest process of chips manufacturing consumes huge energy of electricity and water, and generates a lot of pollutants and wastes.
The speech will begin with a brief introduction of Green Manufacturing and its needed Fab Facility Systems following with their intertwined relationship and issues. Then, TSMC’s mega-fab will be used to exemplify the strategic methods of mitigating energy consumption, contaminants, wastes and their technic trends
Progress in Next-Generation Power Electronics Driven by SiC Power Semiconductors
Abstract
Since the majority of losses in power converters originate from power semiconductor devices, reducing device losses is essential to improving overall efficiency. Traditional power semiconductor devices based on silicon (Si) are approaching their theoretical performance limits due to their own material properties. Consequently, new approaches are being sought, including the adoption of wide bandgap (WBG) semiconductors. Among them, silicon carbide (SiC) stands out due to its high critical electric field, excellent thermal conductivity, compatibility with existing Si processing technologies, and scalability in wafer manufacturing.
In this presentation, the historical development of next-generation power electronics technologies based on SiC, along with the current status of SiC power device adoption and recent technological advances, will be introduced.
Application Area 6
Development of MBS-LAB: an Automated Bio-Experiment System for Microgravity Conditions in Low Earth Orbit using Our Semiconductor-Based Microscopic Observation Device
IDDK Co., Ltd.
Abstract
Towards the Future of Fisheries
Professor, University of the Ryukyus
Abstract
Towards the Future of Fisheries: Sustainable Synergy between Land-based Aquaculture and Agriculture Future issues in food production from the perspective of the fisheries sector are food shortages due to population growth, the sustainability of energy supply, the negative impacts of food loss and waste, and the management difficulties in fisheries caused by a shortage of persons bearing responsibility. The creation of a new industry that transcends the traditional boundaries between agriculture and fisheries may be a way to solve these issues. The goal is to realize a circular society where young people take the lead in cultivating and providing food. Under three key targets – (1) establishing a foundation for efficient food circulation, (2) developing core technologies for energy circulation, and (3) advancing technologies for high-level utilization of information – we will pursue the development of technologies such as the recirculating aquaculture systems, efficient electricity management, and agricultural production including aquaponics. These technologies will be thoroughly integrated through smart systems and packaged as a new agriculture-fisheries integrated industry for global deployment.
Development of an AI-Powered Robotic System for Vineyard Grape Harvesting
Associate Professor, Kitami Institute of Technology
Abstract
This study presents the development of an AI-powered robotic system designed for the autonomous harvesting of vineyard grapes. The system integrates computer vision, deep learning-based fruit detection, and robotic manipulation to identify and harvest ripe grape clusters with precision. Utilizing RGB and infrared imaging, the robot can operate under varying lighting and occlusion conditions commonly found in vineyards. An EV-type wheel-drive vehicle enables navigation across uneven terrain and slopes using RTK-GNSS. Field trials demonstrate improved harvesting efficiency, reduced labor requirements. The proposed system offers a promising solution to labor shortages and enhances the automation of viticulture operations.