Advanced packaging is vital for quantum computing because it enables qubit scaling, manages extreme cryogenic environments, and prevents signal interference. Superconducting materials can be used as interconnects and microbumps, while the heat dissipation in the flip-chip bonding must be kept low because the qubits are fragile. Stacking control electronics closer to the quantum processor reduces the number of bulky wires and heat dissipation from room temperature. Advanced packaging will also enable a modular design methodology of quantum processors that connects small modules or chiplets onto a sub-system, instead of a single, massive monolithic quantum processor.
In this workshop, world experts will discuss the challenges for advanced packaging for quantum computing, such as superconducting interconnects, direct bonding, flip-chip and hybrid bonding of cryo-CMOS control circuits, chiplet integration, on-chip photonic links, and sparse interconnect between qubit modules.